Multiple high speed (Fuji) fine pitch and flexible (Mydata) SMT Lines
Experienced volume BGA and micro BGA placement
Full Box Build/Total Integration capability, ultrasonic welding, conformal coating
Programming of Microprocessors, Micro Controllers, Memory Devices and PLD's
In-Circuit test: Genrad, Teredyne, Power Test
In-circuit, Functional, Burn-In and Systems Level Test
Agency approvals: UL, CUL, CCC, CSA, TUV, Demko
RoHS Compliant
Three manufacturing facilities within a ninety minute drive from Hong Kong. Combined square footage of 975,000 square feet, fully air conditioned and humidity controlled manufacturing facilities
Utilizes ERP system for materials, manufacturing and data collection.
Experienced international procurement and logistics professionals.
Design Support
DFT and DFM
Value Engineering
BOM Optimization & Cost reduction
Supply Base Management
Worldwide procurement of material
Multi-sourcing of components – single source alternatives, obsolete components, materials, manufacturing and data collection.